ligitek electronics co.,ltd. property of ligitek only data sheet lsd215/63hs-xx-pf single digit led display (0.28 inch) doc. no : qw0905- rev. : a date : 07 - apr. - 2006 lsd215/63hs-xx-pf lead-free parts pb
pin no.1 1/8 page ligitek electronics co.,ltd. property of ligitek only part no. package dimensions lsd215/63hs-xx-pf note : 1.all dimension are in millimeters and (lnch) tolerance is 0.25(0.01") unless otherwise noted. 2.specifications are subject to change without notice. lsd215/63h-sxx-pf ligitek 3.5 0.5 0.8(0.032") 7.0 (0.28") 8.15(0.321") 5.08(0.2") 9.85 (0.388") 1 3 5 10 97 4 2 8 6 6.0 (0.236") 7.62 (0.3") 0.45 typ
5 9 dp g lsd2153hs-xx-pf 3,8 10 1 4 6 2 de c bf dp g 5 9 f de c b 10 1 4 6 2 lsd2163hs-xx-pf 3,8 7 7 a a 2/8 internal circuit diagram ligitek electronics co.,ltd. property of ligitek only page lsd215/63hs-xx-pf part no.
cathode f cathode g cathode a cathode dp cathode c cathode d anode f anode g anode a anode c anode d anode dp page3/8 lsd2163hs-xx-pf electrical connection 1 2 4 3 1 pin no. 2 4 3 lsd2153hs-xx-pf 5 7 6 8 10 9 5 7 6 8 10 9 pin no. ligitek electronics co.,ltd. property of ligitek only common cathode anode e common cathode anode b common anode cathode e common anode cathode b lsd215/63hs-xx-pf part no.
v 2000 esd electrostatic discharge( * ) 4/8 page ma ma mw a unit typ. iv-m 31.02:1 ratings 75 60 30 hys -25 ~ +85 -25 ~ +85 10 i f i fp pd ir t opr tstg parameter symbol operating temperature storage temperature solder temperature 1/16 inch below seating plane for 3 seconds at 260 peak forward current per chip (duty 1/10,0.1ms pulse width) power dissipation per chip reverse current per any chip forward current per chip absolute maximum ratings at ta=25 min. vf(v) min.max. 18.0 1.72.6 (nm) 15 587 electrical common cathode common anode chip material algainp yellow emitted common cathode or anode d ( nm) part no lsd2153hs-xx-pf note : 1.the forward voltage data did not including 0.1v testing tolerance. 2. the luminous intensity data did not including 15% testing tolerance. part selection and application information(ratings at 25) lsd2163hs-xx-pf iv(mcd) ligitek electronics co.,ltd. property of ligitek only * static electricity or power surge will damage the led. use of a conductive wrist band or anti-electrosatic glove is recommended when handing these led. all devices, equipment and machinery must be properly grounded. lsd215/63hs-xx-pf part no.
5/8 page ligitek electronics co.,ltd. property of ligitek only if=20ma if=10ma if=20ma if=20ma vr=5v volt nm nm mcd vf d iv a ir iv-m symbol unittest condition forward voltage per chip luminous intensity per chip spectral line half-width dominant wavelength reverse current any chip parameter luminous intensity matching ratio test condition for each parameter lsd215/63hs-xx-pf part no.
fig.3 forward voltage vs. temperature fig.5 relative intensity vs. wavelength ambient temperature( ) r e l a t i v e i n t e n s i t y @ 2 0 m a wavelength (nm) f o r w a r d v o l t a g e @ 2 0 m a n o r m a l i z e @ 2 5 fig.4 relative intensity vs. temperature ambient temperature( ) r e l a t i v e i n t e n s i t y @ 2 0 m a n o r m a l i z e @ 2 5 typical electro-optical characteristics curve forward voltage(v) fig.1 forward current vs. forward voltage f o r w a r d c u r r e n t ( m a ) forward current(ma) fig.2 relative intensity vs. forward current r e l a t i v e i n t e n s i t y n o r m a l i z e @ 2 0 m a ligitek electronics co.,ltd. property of ligitek only 1.0 0.1 1.0 10 100 1000 1.0101001000 0.0 0.5 1.0 1.5 2.0 2.5 3.0 -40-200204060 1.0 1.1 1.2 500 550 600 0.0 0.5 1.0 1.52.02.53.0 80100 0.8 0.9 -20 -40 40 20 080100 60 2.0 0.0 0.5 1.0 1.5 2.5 3.0 650 hys chip page 6/8 lsd215/63hs-xx-pf part no.
page 7/8 ligitek electronics co.,ltd. property of ligitek only soldering condition(pb-free) 1.iron: soldering iron:30w max temperature 350 c max soldering time:3 seconds max(one time) distance:solder temperature 1/16 inch below seating plane for 3 seconds at 260 c 2.wave soldering profile dip soldering preheat: 120 c max preheat time: 60seconds max ramp-up 2 c/sec(max) ramp-down:-5 c/sec(max) solder bath:260 c max dipping time:3 seconds max distance:solder temperature 1/16 inch below seating plane for 3 seconds at 260 c 260 c3sec max 5 /sec max 260 120 temp( c) time(sec) 150 50 100 2 /sec max 25 0 preheat 0 60 seconds max lsd215/63hs-xx-pf part no.
the purpose of this is the resistance of the device which is laid under condition of low temperature for hours. the purpose of this test is the resistance of the device under tropical for hours. the purpose of this is the resistance of the device to sudden extreme changes in high and low temperature. this test intended to see soldering well performed or not. this test intended to determine the thermal characteristic resistance of the device to sudden exposures at extreme changes in temperature when soldering the lead wire. solderability test 1.t.sol=230 5 2.dwell time=5 1sec 1.t.sol=260 5 2.dwell time= 10 1sec. 1.ta=65 5 2.rh=90%~95% 3.t=240hrs 2hrs 1.ta=105 5 &-40 5 (10min) (10min) 2.total 10 cycles solder resistance test high temperature high humidity test thermal shock test mil-std-202: 208d mil-std-750: 2026 mil-std-883: 2003 jis c 7021: a-2 mil-std-202: 210a mil-std-750: 2031 jis c 7021: a-1 mil-std-202: 107d mil-std-750: 1051 mil-std-883: 1011 mil-std-202:103b jis c 7021: b-11 the purpose of this is the resistance of the device which is laid under condition of high temperature for hours. ligitek electronics co.,ltd. property of ligitek only this test is conducted for the purpose of detemining the resistance of a part in electrical and themal stressed. reliability test: 1.ta=-40 5 2.t=1000 hrs (-24hrs, +72hrs) 1.ta=105 5 2.t=1000 hrs (-24hrs, +72hrs) 1.under room temperature 2.if=10ma 3.t=1000 hrs (-24hrs, +72hrs) low temperature storage test high temperature storage test operating life test test itemtest condition jis c 7021: b-12 mil-std-750: 1026 mil-std-883: 1005 jis c 7021: b-1 mil-std-883:1008 jis c 7021: b-10 reference standard description 8/8 page lsd215/63hs-xx-pf part no.
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